The Macotakara medium has published a couple of images from the component supplier Moumantai and in which, supposedly, we can see the appearance of the iPhone 5S motherboard.
It is the first time that we see photos of this component and if we compare it with the iPhone 5 plate, we can already see some quite striking differences. The most notable is that the surface of Apple's Ax chipset has increased its dimensions, occupying practically the entire width of the motherboard.
Sadly, in the iPhone 5S motherboard photograph all physical components are missing so we cannot know the hardware characteristics that the next Apple phone will have.
At the level of shape, there are some subtle differences such as the arrangement of the anchors with the body of the terminal and a lower area with slightly modified shape and that corresponds to the place where the speaker is placed.
The iPhone 5S is expected to launch this fall Along with the final version of iOS 7. At the hardware level, the usual improvements are expected (better processor, better GPU, perhaps more RAM) and a rear camera whose sensor could reach 12 Megapixels of resolution.
More information - Do more components of the iPhone 5S appear?
Source - MacRumors
