3D sensors will reach Android terminals next year

IPhone X has a technology that we had not seen never on a mobile device such as its TrueDepth complex, a set of cameras and sensors on the front of the terminal. With this hardware built into an Apple device, you can give developers free rein on how to exploit these new technologies.

From some English media such as DigiTimes they ensure that these 3D sensors (such as those incorporated in the iPhone X) could reach Android devices during 2018. Chinese manufacturers Huawei, Xiaomi or Oppo could be incorporating this technology in the high-end of their future devices.

The iPhone X has kicked off: 3D sensors are here to stay

So far we have certified the technology of the iPhone X as exceptional, but the TrueDepth complex with 3D sensors and cameras that I was talking about before was one of the impediments in the production of the new Apple terminal. The production of this type of technology had not yet been massive and therefore the manufacturing experience was not enough to satisfy the production demand that the big apple wanted.

All the latest information point to 3D sensor providers such as Largan Prevision, Sunny Optical, Orbbec or Himax Technologies offer these 3D sensors to new companies related to the Android world such as Huawei or Xiaomi. Long Forecast It is known as one of the providers of some Android devices and some of the hardware in relation to sensors of the iPhone X:

[…] Largan, which currently has advantages in terms of technology, patents, capacity and design, has solutions for 3D detection and lens modules to obtain constant orders from existing customers.

Sometimes we underestimate the hardware we have in our devices and all the research and development that goes into it. Apple has invested millions of dollars in achieving a complex of sensors, lenses and infrared cameras that allow the user to unlock the terminal only and exclusively with their own face.

Other companies such as Orbbec have followed Apple's path and are known to be researching and developing lightweight 3D cameras, new algorithms and new sensors that they could offer companies to introduce into their new devices and surprise users with their technology. 


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