The current models (iPhone 13 Pro and 13 Pro Max) already have a significant "hump" to be able to incorporate the camera lenses that Apple decided to include, however, they can be small compared to what is expected in the iPhone Pro Max 14 according to the latest leaked photos.
And it is that, according to the image that has been leaked, it is expected that the "hump" of the camera of the next iPhone 14 Pro Max is the one that occupies the most and that Apple has installed in its flagships. The new leaked photo offers at a glance just how prominent it is compared to the current iPhone 13 Pro Max.
All iPhone 14 models are expected to have improvements to their wide-angle camera but, looking at these latest images and the latest rumors, it is expected that Pro models also feature significant improvements to the telescopic camera.
As commented by analysts such as Ming-Chi Kuo, The iPhone 14 Pro will equip a 48 Mpx camera, improving the current 12 Mpx in addition to the possibility of recording in 8K. The new camera would also have the possibility of capturing 12 Mpx thanks to a process known in English as pixel-binning which joins the information from smaller pixels to form a "super-pixel" to improve sensitivity in low-light environments.
All this forces Apple to mount a greater "hump" on its devices as shown in the image leaked by @lipilipsi on his Twitter. showing a significant increase vs. the current iPhone 13 Pro Max (on the right of the image). This is consistent with the leaks of the renders that occurred in February where it was indicated that it would increase its size from the 3,16mm of the current iPhone 13 Pro Max to 4,17mm. Also, the diagonal of the hump would also be increased by 5%.
We have seen how the size of the camera in our devices has been increasing year after year and, after seeing it for a while, we got used to it or it even seems tiny once we compare it with other models. Surely this time it is no different and we make ourselves to any size that Apple decides to incorporate in our new "hump".
