I-Apple Silicon liqela labaqhubekekisi be-Apple abayilwe ngokwabo kuyilo lwe-ARM. Emva kokuthatha inyathelo ngomboniso we-M1 chip kwiminyaka eyadlulayo kwaye udibanise kwi-MacBook yakho, i-iPad Pro okanye i-iMac, iyenzile. inguqu ye-hardware-level iqala ukwenza ingqiqo eyayifunwa ngokuzimela kweIntel chips. Ezinye imidiya ziqinisekisa ukuba iitshiphusi ze-Apple ezilandelayo iya kuba yi-3 nanometer chips, ngamandla amakhulu kunye nokusebenza kakuhle kwamandla okukwazi ukwandisa ukusebenza kwezixhobo, kwaye ziya kuveliswa yi-TSMC kwiplanti yayo entsha e-Arizona eMelika.
Iichips ezilandelayo ze-Apple ze-nanometer ezi-3, eziveliswe e-US
Itekhnoloji ye-hardware yangaphakathi ibalulekile ekuphuculeni ukusetyenziswa kwezixhobo ngaphakathi kwesixhobo. Xa sithetha ngeesayizi zetshiphu sithetha ngolungelelwaniso phakathi kobungakanani beetransistors ngaphakathi kwiprosesa. Ukuthetha nje, i-transistor encinci kukuba, umbane okhawulezayo unokujikeleza ngaphakathi kuwo kwaye, ngoko ke, ukwandisa isantya onokuthi usombulule ngaso ii-equations obonelelwa yinkqubo. Ukongeza, ngokunciphisa ubungakanani be-transistors, sinciphisa ubungakanani beeprosesa kwaye ke ngoko sinciphisa ubukhulu abahlala ngaphakathi kwezixhobo kunye nobukhulu bazo ukuze zenziwe izixhobo ezincinci kunye nezisebenzayo.
Kungoko ukubaluleka kwe yenza iiprosesa ezintsha ngeetransistor ezincinci ezikwaziyo ukuphucula ukusebenza kwizizukulwana ngezizukulwana. Okwangoku, i-chip ye-A16 ye-Apple, leyo ifunyenwe kwi-iPhone 14 Pro umzekelo, yi-5-nanometer chip. Enkosi ngolwazi oluvela kumhlalutyi waseTshayina, watshintsha uMorris, siyazi ukuba inkampani ebonelela ngeeprosesa kwi-Apple, i-tsmc, Bendizakuba ready for velisa iitshiphusi ze-nanometer ezi-3 kwiplanti yayo entsha e-Arizona (USA):
3nm, TSMC, okwangoku inesicwangciso, kodwa ayikagqitywa ngokupheleleyo. Isigaba sesibini siphantse sagqitywa, kwindawo enye e-Arizona. I-5nm sisigaba sokuqala, i-3nm sisigaba sesibini.
ishumi elinambini lezigidi zeerandi yimali etyalwe yi-TSMC, inkampani yaseTaiwan, ukuvelisa Iitshiphusi ezi-5 ze-nanometer kumhlaba wase-US. Ezinye zezi chips yiA16 chip okanye iM2 chip. Nangona kunjalo, iM2 Pro ezayo, iitshiphusi zeM3 okanye iA17 chip ye-iPhone 15 Pro inokuba Iitshiphusi ze-nanometer ezi-3.
I-TSMC inokulungiswa ukuyila kunye nokuvelisa iitshiphusi ezilo bukhulu phantsi kwetekhnoloji ebizwa ngokuba yi-'N3' kwisityalo sayo sase-US. Olu hlobo lweprosesa luya kwandisa umthamo onengqondo nge-70%, isantya nge-15% kumandla afanayo kunye nokuya kuthi ga kwi-30% ukuba amandla ayancipha ukufikelela kwisantya esifanayo njengangoku. Kungumceli mngeni kwinqanaba le-hardware enokunyusa isantya sezixhobo ezilandelayo ze-Apple kunye iveliswe eMelika.