Apple runs out of 3D NAND chips and has to go to Samsung

IPhone SE motherboard

The manufacturers of the iPhone seem to be having trouble finding the components of what will undoubtedly be the mobile device of the year, the iPhone 8. If a few weeks ago we were talking about the manufacture of the Nintendo Switch being affected by the manufacture of the Apple devices, now it seems that not even Apple itself can manufacture them due to the lack of components, at least it is the problem reported from the Foxconn chain.

So much so that Apple has had to turn to experts in the field such as Samsung to help them manufacture the 3D NAN chipD, just when it appeared that the Cupertino company had managed to sever its ties with the South Korean firm.

Apple started using these 3D NAND chips with the launch of the iPhone 7, but since then its quantity has decreased by no less than 30%. The producers of this component for the iPhone until now were SK Hynix and Toshiba, but Digitimes has obtained news about their insufficiency, which is causing serious problems in the production chain, basically because this type of memory is quite delicate and apparently there are not a few that employees render useless along the way or do not pass the enough quality checks to fit into an iPhone.

In short, Apple has had to turn once again to the South Korean giant to provide it with material, right after having gotten rid of it in the matter of screens and processors, showing that there was life far beyond Samsung ... or not. We remember that containing Samsung products inside the iPhone is not a negative distinction, Samsung makes products of enormous quality that has made it one of the leading consumer electronics brands.


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  1.   Antonio said

    well as always! if it is not samsung it is sony if not lg if not sharp…. and so it was all life.