The motherboard of the iPhone 6 can be seen in a new photo

After showing you some very detailed photographs of the appearance of the front panel of the iPhone 6, now it is the turn of the motherboard of the terminal that after so long, has been photographed with all the components already mounted on it.

This leak does not reveal any relevant information about the features that the iPhone 6 could haveEven the processor is under a metal casing that, I imagine, will act as a heatsink to transmit the heat generated by the chipset directly to the aluminum casing and thus avoid overheating when we use games or applications with high load for CPU and GPU.

Although the Apple A8 processor does not show us its appearance, there are other components that can be seen as is the case of flash memory, the slot to insert the SIM card and the different connectors to communicate the motherboard with other components such as the screen, microphones, camera, etc.

As always, this type of leaks we cannot guarantee that they are 100% faithful to the final product, however, everything seems to indicate that this motherboard is from an iPhone 6, its structure coinciding with other leaks of the iPhone 6 case that we have seen previously. As is usual, as we get closer to the presentation date, the pieces of the puzzle that we see every day begin to fit together much better.

Apple is expected to present the iPhone 6 at a special event that will take place next September 9. There is little left for us to see the next generation of Apple's phone, one of the most anticipated by many users thanks to the increase of its screen to 4,7 inches and with a possible second version of 5,5 inches.