TSMC could be the sole supplier of Apple's next A12 chip for this year

The rumors about him launch of three new iPhones Throughout these years it is not a short time but it has been commented on for several months. The reality is that the current prices of the last generations are too high and Apple could launch cheaper alternatives with the same technology but sacrificing other aspects such as materials, and that would be the SE model.

These iPhones would carry inside the A12 chip, new crown jewel of the big apple that would be in charge of centralizing all the content of the hardware and supporting the great technology that the new terminals could have. The latest reports suggest that TSMC would be the sole supplier of these chips for all of 2018.

Apple prefers not to charge Samsung and might need TSMC for the A12 chip

One of the novelties that the big apple always introduces each year are their new chips that will carry your products. Each chip headed by the letter "A" far exceeds its predecessor. An example of this is the A11 Bionic chip that the iPhone X has presented a few months ago that has been able to melt the records of other companies and it has even doubled the speed of the A10 Fusion.

This A11 Bionic has 6 cores of which 2 are high performance and the rest, exceed the speed of its predecessor by more than 70%. These advances mean millionaire investments in R&D that are seen year after year. The next A12 chip from the big apple It is expected to exceed the data of the A11 Bionic, how far will it be able to go?

This A12 chip, according to the latest rumors, could be provided only by the Taiwanese tsmc, known for other collaborations with the big apple for previous processors. Samsung participated in the supply of chips for the Big Apple but since offers key elements for the new iPhones, Apple seems not to want harass to the Korean company.

As for news about how the A12 will be, there are very few information available except for some information that could be false. It is expected to be based on a manufacturing process of 7 nm using a smaller plate making use of ultraviolet technology to reduce its size and reduce thickness, for example, of the new devices in the big apple for this new year that has just begun.